TRACE AND SPACE WIDTH Class 2

Preferred Pad Construction for Class 2 – 0.15/0.15 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout 0.25mm + 0/-0.25mm • Plane anti-pad 0.75mm • Trace width 0.15mm/Space width 0.15mm • These designs require 0.5‡ ounce outer layer copper foil construction for […]

TRACE AND SPACE WIDTH for Class 1

Preferred Pad Construction for Class 1 – 0.2/0.2 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.50mm • Hole callout 0.25mm + 0/-0.25mm • Plane anti-pad 0.7mm • Trace width 0.2mm/Space width 0.2mm • These designs require 0.5‡ ounce outer layer copper foil construction for […]

CAN H and CAN

The ISO 11898−2 bus consists of the CAN_H (high) and CAN_L (low) data lines and a common ground signal. A 120  termination resistor is located at each end of the bus to minimize reflections and ringing on the waveforms

Motor opration

How to motor move one direction or both direction : The first is a low-side drive and the second is a high-side drive. The advantage to using the low-side drive is that a FET driver is not typically needed. Bidirectional control of a BDC motor requires a circuit called an H-bridge. The H-bridge, named for […]

Flex PCB

Available pyralux laminates are Copper thickness (one OR both side) – 0.5, 1.0, 2.0 oz copper. PI dielectric thickness – 0.5, 1.0, 2.0, 3.0, 5.0 mil. Adhesive thickness (For LF & FR laminates) – 0.5, 1.0, 2.0 mil. Substrates– Polyimide: 1 – 3 mil– Epoxy– TeflonCopper

Power Integrity

Basic of Power Integrity you can find here Power integrity or PI is an analysis to check whether the desired voltage and current are met from source to destination. Today, power integrity plays a major role in the success and failure of new electronic products For more Detail