Tab Routing

Aspect Ratio Plating Capability

Annular Ring

The difference between the drill diameter and the corresponding circuitry pad diameter as measured as Annular Ring

Drill Selection

Available drill sizes are listed below. For holes plated with copper and hot air leveled, a drill size will be chosen that is 0.125mm to 0.15mm larger than the specified nominal finished hole size. For those holes which will only receive copper plating and organic coating, and no hot air leveled solder, a drill size […]

Etch Factor

TRACE AND SPACE WIDTH Class 3

Preferred Pad Construction for Class 3 – 0.125/0.125 Surface Mount Technology Recommendations for two traces between 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout 0.25mm +0/-0.25mm • Plane anti-pad 0.75mm • Trace width 0.125mm / Space width 0.125mm • Route grid 0.05mm • These designs require 0.5‡ ounce outer […]

TRACE AND SPACE WIDTH Class 2

Preferred Pad Construction for Class 2 – 0.15/0.15 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout 0.25mm + 0/-0.25mm • Plane anti-pad 0.75mm • Trace width 0.15mm/Space width 0.15mm • These designs require 0.5‡ ounce outer layer copper foil construction for […]

TRACE AND SPACE WIDTH for Class 1

Preferred Pad Construction for Class 1 – 0.2/0.2 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.50mm • Hole callout 0.25mm + 0/-0.25mm • Plane anti-pad 0.7mm • Trace width 0.2mm/Space width 0.2mm • These designs require 0.5‡ ounce outer layer copper foil construction for […]

Complexity Factors Matrix

Expedition Basic

basic