4 causes of signal integrity issue

1 signal quality of one net , including loss in Net 2. cross talk between two nets , including power and Ground 3. rail collapse in the power and Ground distribution network 4. Electromagnetic interference and radiation from entire system    

Signal Integrity Problem

Mainly signal integrity problem falls following category Timing EMI Noise Timing is complicated field of study by itself in one clock of cycle a certain no of operation will happen this short time must be divided up and allocated in budget in all a various opretions .some time allocated for gate switching , for propagating […]

what is the high Speed Board

: Most of the electronics product signal integrity effect begin to be important at clock frequency above about 100Mhz or rise time shorter then about 1 ns  this is some time called the high frequency or high speed regime.

Signal integrity Issue

As clock frequency increase identifying and solving signal integrity problem become critical . the successful companies will be those that master signal integrity problem  an implement a sufficient design process to eliminate this problem it is incorporating new design rule and new technology and new analysis tool that higher performance design can be implemented and […]

Tab Routing

Aspect Ratio Plating Capability

Annular Ring

The difference between the drill diameter and the corresponding circuitry pad diameter as measured as Annular Ring

Drill Selection

Available drill sizes are listed below. For holes plated with copper and hot air leveled, a drill size will be chosen that is 0.125mm to 0.15mm larger than the specified nominal finished hole size. For those holes which will only receive copper plating and organic coating, and no hot air leveled solder, a drill size […]

Etch Factor

TRACE AND SPACE WIDTH Class 3

Preferred Pad Construction for Class 3 – 0.125/0.125 Surface Mount Technology Recommendations for two traces between 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout 0.25mm +0/-0.25mm • Plane anti-pad 0.75mm • Trace width 0.125mm / Space width 0.125mm • Route grid 0.05mm • These designs require 0.5‡ ounce outer […]

TRACE AND SPACE WIDTH Class 2

Preferred Pad Construction for Class 2 – 0.15/0.15 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout 0.25mm + 0/-0.25mm • Plane anti-pad 0.75mm • Trace width 0.15mm/Space width 0.15mm • These designs require 0.5‡ ounce outer layer copper foil construction for […]