Preferred Pad Construction for Class 3 – 0.125/0.125 Surface Mount Technology
Recommendations for two traces between 1mm BGA pads are as follows:
• Via Pad diameter 0.55mm
• Hole callout 0.25mm +0/-0.25mm
• Plane anti-pad 0.75mm
• Trace width 0.125mm / Space width 0.125mm
• Route grid 0.05mm
• These designs require 0.5‡ ounce outer layer copper foil construction for multilayers.
Solder Mask over bare copper is preferred.
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TRACE AND SPACE WIDTH Class 3
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