Signal integrity Issue

As clock frequency increase identifying and solving signal integrity problem become critical . the successful companies will be those that master signal integrity problem  an implement a sufficient design process to eliminate this problem it is incorporating new design rule and new technology and new analysis tool that higher performance design can be implemented and […]

TRACE AND SPACE WIDTH Class 2

Preferred Pad Construction for Class 2 – 0.15/0.15 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout 0.25mm + 0/-0.25mm • Plane anti-pad 0.75mm • Trace width 0.15mm/Space width 0.15mm • These designs require 0.5‡ ounce outer layer copper foil construction for […]