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TRACE AND SPACE WIDTH for Class 1

Preferred Pad Construction for Class 1 – 0.2/0.2 Surface Mount Technology
Recommendations for one trace through 1mm BGA pads are as follows:
• Via Pad diameter 0.50mm
• Hole callout 0.25mm + 0/-0.25mm
• Plane anti-pad 0.7mm
• Trace width 0.2mm/Space width 0.2mm
• These designs require 0.5‡ ounce outer layer copper foil construction for multilayers.
Solder Mask over bare copper is preferred.