4 causes of signal integrity issue4 causes of signal integrity issue
1 signal quality of one net , including loss in Net 2. cross talk between two nets , including power and Ground 3. rail collapse in the power and Ground
1 signal quality of one net , including loss in Net 2. cross talk between two nets , including power and Ground 3. rail collapse in the power and Ground
Mainly signal integrity problem falls following category Timing EMI Noise Timing is complicated field of study by itself in one clock of cycle a certain no of operation will happen
: Most of the electronics product signal integrity effect begin to be important at clock frequency above about 100Mhz or rise time shorter then about 1 ns this is some
As clock frequency increase identifying and solving signal integrity problem become critical . the successful companies will be those that master signal integrity problem an implement a sufficient design process
The difference between the drill diameter and the corresponding circuitry pad diameter as measured as Annular Ring
Available drill sizes are listed below. For holes plated with copper and hot air leveled, a drill size will be chosen that is 0.125mm to 0.15mm larger than the specified
Preferred Pad Construction for Class 3 – 0.125/0.125 Surface Mount Technology Recommendations for two traces between 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout
Preferred Pad Construction for Class 2 – 0.15/0.15 Surface Mount Technology Recommendations for one trace through 1mm BGA pads are as follows: • Via Pad diameter 0.55mm • Hole callout